Home » United States Articles » Palomar Technologies Develops Wire-Bond-Free Direct Attach for LEDs
Palomar Technologies Develops Wire-Bond-Free Direct Attach for LEDs
Assembly Services is supporting more than 390 700µm LEDs that are attached with an Au/Sn solder to a single 50mm metal core carrier.
CARLSBAD, CA, February 03, 2012 /United States PR News/ -- Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced a precision eutectic process development for direct attach light emitting diodes (LEDs).
"Direct-attach LEDs are the next generation of solid-state LED emitters that deliver superior value for consumer products and markets that include TV backlighting, camera flash and a variety of general illumination needs," explains Donald Beck, General Manager of Palomar Technologies Assembly ServicesTM. "Assembly Services is supporting more than 390 700µm LEDs that are attached with an Au/Sn solder to a single 50mm metal core carrier. Palomar Technologies' Pulsed Heat System is a major contributor to this development, allowing our precision die attach systems to control LED exposure much more effectively than most other processes. The bondpad-down design of direct-attach LEDs eliminates the need for wire bonds, yet improves the thermal management."
Palomar Technologies is exhibiting at the LED-focused show, Strategies in Light 2012, in booth #709 on February 7-9 in Santa Clara, CA. Julie Adams, Director of WW Assembly Services Sales will be on site to assist in discussions about Palomar Technologies' current LED packaging capabilities, including direct-attach LED eutectic bonding.
Also on February 7-9, Palomar Technologies is exhibiting as a premier sponsor at IMAPS RF 2012 in booth #RF01, held in San Diego, CA. Bradley Benton, Western Americas Sales Manager, will be presenting an overview of Palomar Technologies' solutions and advanced RF automated packaging processes on February 8 at 1:00pm, local conference time.
Contact Palomar Technologies to arrange an on-site meeting at either Strategies in Light 2012 or IMAPS RF 2012.
About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of die attach solutions, wire bonding equipment, optoelectronic packaging systems and contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to obtain precision wire and ball bonders and automated component placement systems. For more information, visit www.palomartechnologies.com.
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Press Release Contact Information:
Jessica Sylvester
Palomar Technologies
Marketing Communications
2728 Loker Ave. West
Carlsbad, CA
USA 92010
Voice: 760-931-3681
Fax: (760) 931-5191
Website: Visit Our Website |
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